Home > Group Members > Dr. Hailong Jiao

Short Biography

Hailong Jiao received the Bachelor degree in Electronic Information Science and Technology from Shandong University, Shandong, China, in 2004 with the highest honor. He got the Master degree in Microelectronics and Solid-State Electronics from the Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China, in 2008. After that, he got the Ph. D. degree in Electronic and Computer Engineering from the Hong Kong University of Science and Technology, Hong Kong, China, in 2012.

He served as a Tenure-Track Assistant Professor in the Electronic Systems group with the Department of Electrical Engineering, Eindhoven University of Technology (TU/e), Eindhoven, The Netherlands from September 2013 to January 2017, and got tenured position in September 2016. He was with IMEC, Leuven, Belgium as a part-time Visiting Researcher from February 2015 to January 2017. He has been an Associate Professor in the School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University since January 2017, and got tenured position in January 2023. He is also Visiting Assistant Professor with the Electronic Systems group of TU/e.

Dr. Jiao’s research area is low-power and variations-resilient VLSI circuit design. He has interests in ultra-low-power ultra-low-voltage circuit design, energy-efficient Computing-in-Memory, and brain-inspired computing with on-chip AI accelerators. 

Education

09/2008 – 12/2012
The Hong Kong University of Science and Technology, Hong Kong, China
Ph. D. in Electronic and Computer Engineering

09/2005 – 07/2008
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China
Master of Engineering in Microelectronics and Solid-State Electronics

09/2000 – 07/2004
Shandong University, Shandong, China
Bachelor of Engineering in Electronic Information Science and Technology

Work Experiences

01/2017 – Present
Associate Professor
Department of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, Shenzhen, China

09/2013 – 01/2017
Assistant Professor
Department of Electrical Engineering, Eindhoven University of Technology, Eindhoven, The Netherlands

02/2015 – 01/2017
Visiting Researcher
3DOT Department, IMEC, Leuven, Belgium

01/2013 – 07/2013
Postdoctoral Research Associate
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China

Honors and Awards

Paper Awards

12/2014      Best Paper Award (1st place), International Conference on Microelectronics, DOHA, Qatar
11/2012      SoC Design Group Award, International SoC Design Conference, Jeju, South Korea

Other Awards

06/2023      The First Prize for Technical Invention awarded by the Ministry of Education of P. R. China
05/2020      Guangdong “Pearl River” Top Young Talent
09/2017      Shenzhen “Peacock” Plan Level C Talent

Academic Services

Associate Editor

IET Electronics Letters (2021 – present)
Elsevier Microelectronics Journal (2015 – present)
World Scientific Journal of Circuits, Systems, and Computers (2014 – present)

Guest Editor for the Special Issue on the IEEE Asia Pacific Conference of Circuits and Systems 2022, IEEE Transactions on Circuits and Systems I (TCAS-I), 2023
Guest Editor for Special Issue “Design and Test of Multi-Chip Packages”, IEEE Design & Test, 2022

Technical Committee Member

IEEE SoC (System-on-Chip) Conference (SOCC 2016 – 2024)
ACM/SIGDA Great Lakes Symposium on VLSI (GLSVLSI 2011, 2022 – 2024)
IEEE European Test Symposium (ETS 2023 – 2024)
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2020 – 2021, 2023)
IEEE International Test Conference (ITC 2022)
IEEE/Euromicro Conference on Digital System Design (DSD 2022, 2023)
IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2014 – 2016, 2018 – 2021)
IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS 2016 – 2021)
IEEE Asia and South Pacific Design Automation Conference (ASP-DAC 2016)
HiPEAC (MemTDAC: Memristor Technology, Design, Automation and Computing 2015 – 2017)
IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D-TEST 2015, 2020)

Organizing Committee Member

Asia Pacific Conference on Circuits and Systems (APCCAS 2022), Tutorial Chair
IEEE European Test Symposium (ETS 2022), Virtual Chair
IEEE Electron Devices and Solid-State Circuits (EDSSC 2018), Organizing Committee Member

International Symposium on Circuits and Systems (ISCAS 2024), Session Chair
IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2020), Session Chair
IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2017), Session Chair

Academic Affiliations

IEEE member
Member of IEEE Circuits and Systems Society
Member of IEEE Solid-State Circuits Society